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Small Form Factor Computer with LGA 1700 for Intel 12th/13th/14th Gen CPU & Q670E PCH, 2x DP, 1x HDMI, 2x COM, 3x LAN

 

System
ProcessorSupport 12th/13th/14th Gen Intel® ADL & RPL Processor (LGA 1700, 35W TDP)
- Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, 35W
- Intel® Core™ i7-14700T/i7-13700TE/i7-12700TE, 35W
- Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, 35W
- Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, 35W
- Intel® Core™ 300T, 35W
- Intel® Pentium® G7400TE, 35W
- Intel® Celeron® G6900TE, 35W
System ChipsetIntel® Q670E Express Chipset
LAN ChipsetIntel® I226LM PCIe 2.5GbE LAN
Intel® I226V PCIe 2.5GbE LAN
Intel® I226V PCIe 2.5GbE LAN
Audio CodecRealtek ALC897
System Memory2x DDR4 3200MT/s SODIMM. Max. up to 64 GB (Default: 8GB)
BIOSAMI UEFI BIOS
WatchdogSoftware Programmable Supports 1~255 sec. System Reset
TPMTPM 2.0

 

Display
Display Port2x Dual Mode DisplayPort 1.4a Max Resolution 4096 x 2304 @60Hz
HDMI1x HDMI 1.4b Max Resolution 4096 x 2304 @24Hz
Multiple Display3x Independent Displays

 

Storage
M.21x M.2 M key Type (2242/2280):
● Support PCIe x4 Gen3 NVMe SSD
● PCIe x4 Gen3 signal from PCH
● Support B+M Key
● Default: 128GB SSD

 

Expansion
M.2 B-Key1x M.2 B key Type: 3042 with Nano SIM Holder
(Support PCIe x1 + USB 3.2 Gen 2 x1 + USB 2.0, 5G/4G/LTE/AI Module)
M.2 E-Key1x M.2 E key Type: 2230 (Support PCIe x1 + USB 2.0; Support CNVi)
Devices Supported:
Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro Supported)

 

Operating System
WindowsWindows 10/11
LinuxLinux Kernel

 

I/O
Audio1x Mic-in, 1x Line-out
COM4x DB9
COM1:RS232/422/485
COM2: RS232/422/485
COM3: RS485
COM4: RS485
DIO8 in / 8 out (Isolated)
LAN3x RJ45 (2.5GbE)
USB6x USB 3.2 Gen2
2x USB 3.2 Gen1
2x USB 2.0 Type-A
Others5x Antenna Holes
1x Power button
1x HD LED
1x Power LED

 

Power
Power AdapterOptional AC/DC 24V/5A, 120W
Power ModeAT, ATX (Default ATX)
Power Supply Voltage9~36VDC
Power Connector4-pin Terminal Block

 

Environment
Operating Temperature0°C to 50°C (35W CPU)
Tested according to:
IEC60068-2-1:2007 (Cold test procedure)
IEC60068-2-2:2007 (Dry heat test procedure)
IEC60068-2-3:2007 (Damp heat, steady state, test procedure)
IEC60068-2-14:2009 (Wide temperature range thermal shock)
Storage Temperature-30°C to 85°C
Relative Humidity10% to 95% (non-condensing)
CertificationUL 62368 Ed. 3, CE, FCC Class A
VibrationWith SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
ShockWith SSD: 50G half-sin 11ms

 

Physical
Construction192 (W) x 240 (D) x 69 (H) mm
Weights2.8 kg
ConstructionExtruded Aluminum with Heavy Duty Metal
Mounting OptionsWall Mounting DIN-Rail Mounting (Optional)

BCO-3000-RPL

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