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Small Form Factor Computer with LGA 1700 for 12/13/14th Gen Intel CPU & Q670E PCH, 2x LAN

 

System
ProcessorSupport 12/13/14th Gen Intel® ADL & RPL S Processor (LGA 1700, 35W TDP)
- Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, up to 24 Cores, up to 5.5 GHz
- Intel® Core™ i7-14700T, up to 20 Cores, up to 5.2 GHz
- Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, up to 4.8 GHz
- Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, up to 14 Core, up to 4.8 GHz
- Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, up to 4 Cores, up to 4.4 GHz
- Intel® Core™ 300T, up to 2 Cores, up to 3.4 GHz
- Intel® Pentium® G7400TE, 2 Cores, 3.0 GHz
- Intel® Celeron® G6900TE, 2 Cores, 2.4 GHz
System ChipsetIntel® Q670E Express Chipset
LAN Chipset2.5 GbE1: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)
2.5 GbE2: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)
Audio CodecRealtek ALC888S
System Memory1x DDR5 4800/5600MHz SODIMM. Max. up to 32GB
GraphicsIntegrated Intel® UHD Graphics 770/730
BIOSAMI 256Mbit SPI BIOS
WatchdogSoftware Programmable Supports 1~255 sec. System Reset
AI AcceleratorSupports up to 4x Hailo-8™ modules
TPMTPM 2.0

 

Display
Display Port4x DisplayPort 1.4a, support resolution 4096 x 2304,
Up to 7680 x 4320 (1x DP Port Co-layout HDMI Connector)
HDMIYes, Shared by 1x DP port
Multiple Display4x Independent Displays

 

Storage
SSD/HDD1x 9mm 2.5" SATA SSD Bay (Internal)
1x 7mm 2.5" SATA SSD Bay (Hot-swappable)
Support RAID 0, 1, 5

 

Expansion
M.2 B-Key1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/PCIe x1 & USB 3.2 Gen1
• Support NVMe Storage/Hailo AI Module/4G/5G

1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/SATA signal
• Support NVMe/SATA Storage/Hailo AI Module/4G/5G
M.2 E-Key1x M.2 E key slot (2230)
• Support PCIe x1 & USB 2.0; Support CNVi
• Support Wifi Module
SIM Socket1x External Mini (Standard) SIM socket
1x External Dual Nano SIM socket
Expansion ModulesEDGEBoost I/O Bracket:
• 4-port 1GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional)
• 2-Port 10GbE RJ45 with Intel X710 Chipset
• 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth)
• 1x RJ45 port for OOB Management Module
• 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module
• 2x M.2 B-Key 2242/3042/3052:
- 2x M.2 (PCIe x2 Lane) for NVMe/AI Module or
- 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached)

 

Operating System
WindowsWindows 10/11
LinuxLinux Kernel 5.x

 

I/O
Audio1x Line-out
CAN2x CAN 2.0 A/B 2-pin Internal header
COM3x RS-232/422/485; 2x RS-232/422/485 Internal header
DIO8 in / 8 out (Isolated)
LAN2x 2.5GbE RJ45
USB6x USB 3.2 Gen 2 (10Gbps)
Others5x WiFi Antenna Holes
1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off
1x PC/Car Mode Switch, 1x Delay Time Switch
1x Clear CMOS Switch
1x Mic In Header (Internal)

 

Power
Power AdapterOptional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/11.67A, 280W
Power ModeAT, ATX
Power Ignition SensingPower Ignition Management
Power Supply Voltage9~48VDC
Power Connector3-pin Terminal Block
Power ProtectionOVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection

 

Environment
Operating TemperatureUL: -25°C to 50°C (35W CPU)
CE/FCC/IC: -25°C to 70°C (35W CPU)
Storage Temperature-30°C to 85°C
Relative Humidity10% to 95% (non-condensing)
CertificationUL 61010-1, 3rd Ed
UL 61010-2-201, Edition 2,
CE, FCC Class A,
EMC Conformity with EN50155 & EN50121-3-2
VibrationIEC60068-2-64:2008
With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
ShockIEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 516.7 Procedure I

 

Physical
Construction192 (W) x 227 (D) x 60.3 (H) mm
Weights2.8kg - 3.6 kg
ConstructionExtruded Aluminum with Heavy Duty Metal
Mounting OptionsWall Mounting kit with Vibration Isolation
DIN Rail Mounting (optional)

RCO-3000-RPL

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