Small Form Factor Computer with LGA 1700 for 12/13/14th Gen Intel CPU & Q670E PCH, 2x LAN
| System | |
|---|---|
| Processor | Support 12/13/14th Gen Intel® ADL & RPL S Processor (LGA 1700, 35W TDP) - Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, up to 24 Cores, up to 5.5 GHz - Intel® Core™ i7-14700T, up to 20 Cores, up to 5.2 GHz - Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, up to 4.8 GHz - Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, up to 14 Core, up to 4.8 GHz - Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, up to 4 Cores, up to 4.4 GHz - Intel® Core™ 300T, up to 2 Cores, up to 3.4 GHz - Intel® Pentium® G7400TE, 2 Cores, 3.0 GHz - Intel® Celeron® G6900TE, 2 Cores, 2.4 GHz |
| System Chipset | Intel® Q670E Express Chipset |
| LAN Chipset | 2.5 GbE1: Intel I226 (Support Wake-on-LAN and PXE, Support TSN) 2.5 GbE2: Intel I226 (Support Wake-on-LAN and PXE, Support TSN) |
| Audio Codec | Realtek ALC888S |
| System Memory | 1x DDR5 4800/5600MHz SODIMM. Max. up to 32GB |
| Graphics | Integrated Intel® UHD Graphics 770/730 |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| AI Accelerator | Supports up to 4x Hailo-8™ modules |
| TPM | TPM 2.0 |
| Display | |
|---|---|
| Display Port | 4x DisplayPort 1.4a, support resolution 4096 x 2304, Up to 7680 x 4320 (1x DP Port Co-layout HDMI Connector) |
| HDMI | Yes, Shared by 1x DP port |
| Multiple Display | 4x Independent Displays |
| Storage | |
|---|---|
| SSD/HDD | 1x 9mm 2.5" SATA SSD Bay (Internal) 1x 7mm 2.5" SATA SSD Bay (Hot-swappable) Support RAID 0, 1, 5 |
| Expansion | |
|---|---|
| M.2 B-Key | 1x M.2 B key Type: 2242/3042/3052 • Support PCIe x2/PCIe x1 & USB 3.2 Gen1 • Support NVMe Storage/Hailo AI Module/4G/5G 1x M.2 B key Type: 2242/3042/3052 • Support PCIe x2/SATA signal • Support NVMe/SATA Storage/Hailo AI Module/4G/5G |
| M.2 E-Key | 1x M.2 E key slot (2230) • Support PCIe x1 & USB 2.0; Support CNVi • Support Wifi Module |
| SIM Socket | 1x External Mini (Standard) SIM socket 1x External Dual Nano SIM socket |
| Expansion Modules | EDGEBoost I/O Bracket: • 4-port 1GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional) • 2-Port 10GbE RJ45 with Intel X710 Chipset • 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth) • 1x RJ45 port for OOB Management Module • 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module • 2x M.2 B-Key 2242/3042/3052: - 2x M.2 (PCIe x2 Lane) for NVMe/AI Module or - 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached) |
| Operating System | |
|---|---|
| Windows | Windows 10/11 |
| Linux | Linux Kernel 5.x |
| I/O | |
|---|---|
| Audio | 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 3x RS-232/422/485; 2x RS-232/422/485 Internal header |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x 2.5GbE RJ45 |
| USB | 6x USB 3.2 Gen 2 (10Gbps) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x Clear CMOS Switch 1x Mic In Header (Internal) |
| Power | |
|---|---|
| Power Adapter | Optional AC/DC 24V/9.2A, 220W Optional AC/DC 24V/11.67A, 280W |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Power Ignition Management |
| Power Supply Voltage | 9~48VDC |
| Power Connector | 3-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection) OCP (Over Current Protection) Reverse Protection |
| Environment | |
|---|---|
| Operating Temperature | UL: -25°C to 50°C (35W CPU) CE/FCC/IC: -25°C to 70°C (35W CPU) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | UL 61010-1, 3rd Ed UL 61010-2-201, Edition 2, CE, FCC Class A, EMC Conformity with EN50155 & EN50121-3-2 |
| Vibration | IEC60068-2-64:2008 With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Physical | |
|---|---|
| Construction | 192 (W) x 227 (D) x 60.3 (H) mm |
| Weights | 2.8kg - 3.6 kg |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting kit with Vibration Isolation DIN Rail Mounting (optional) |

